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SMT
5731
Surface mount heat sink for D-PAK (TO-252) package semiconductors
Air Velocity — Feet Per Minute
0
200
400
600
8 00
1000
100
8 0
60
25
20
15
8 .00
(0.315)
22. 8 6
(0.900)
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
40
20
10
5
remove the heat indirectly without
contacting the device like traditional
0
0.0
0.5
1.0 1.5 2.0
2.5
0
10.16
(0.400)
8 .13
(0.320)
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
Heat Dissipated — Watts
1.3
(0.05)
10.41
(0.410)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
tab to the heat sink.
ORDERING INFORMATION
Refer to Figure A and B on page 26 for board footprint information
Part Number
573100D00010G
573100D00000G
Packaging
13" Reel, 250 per reel
Bulk, 500 per bag
See page 25 for tape and reel information
5733
Surface mount heat sink for D 2 PAK (TO-263) package semiconductors
Air Velocity — Feet Per Minute
50
0
200
400
600
8 00
1000
20
12.70
(0.500)
40
16
30
20
12
8
26.16
(1.030)
Surface mount heat sink for D 2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
10
0
0.0
0.5
1.0 1.5 2.0
Heat Dissipated — Watts
2.5
4
0
10.16
(0.400)
1.3
12.70
7.37
(0.290)
through hole heat sinks. The device
(0.05)
(0.500)
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
Part Number
573300D00010G
573300D00000G
Packaging
13" Reel, 250 per reel
Bulk, 500 per bag
See page 25 for tape and reel information
7106
Surface mount heat sink for D 2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
5.33
Air Velocity — Feet Per Minute
(0.210)
0
200
400
600
8 00
1000
100
10
Surface mount heat sink for D 2 PAK
8 0
60
40
8
6
4
14.99
(0.590)
10.92 14.99
(0.430) (0.590)
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
20
0
0
1
2 3
Heat Dissipated — Watts
4
5
2
0
7.62
(0.300)
25.91
(1.020)
10.16
(0.400)
9.52
(0.375)
tab to the heat sink.
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Part Number
7106D/TRG
7106DG
Packaging
13" Reel, 200 per reel
Bulk, 500 per bag
Refer to Figure C on page 26 for board footprint information
See page 25 for tape and reel information
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
ASIA
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
24
www.aavidthermalloy.com
EUROPE
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
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